Apparatuses, systems, and methods for collecting information

ABSTRACT

Described embodiments include devices and systems for collecting information from environments, including from hazardous environments. Methods of deploying such devices are also disclosed.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Pursuant to 35 U.S.C. §202(c)(6) of the Patent Act, Applicants specifythat this invention was made, in part, with U.S. government supportunder Department of Defense (DOD) grant number N65538-08-M-0016. Thegovernment may have certain rights in the invention.

FIELD OF THE INVENTION

The invention relates to the detection and collection of information andimages in an environment, and in particular to systems, methods, andapparatus for collecting the information and images.

BACKGROUND

Collection of images and detection of environmental conditions,particularly in a hazardous environment, is critical to rapidsituational assessment and damage control. For example, damage sustainedon board a boat or other naval vessel, whether due to enemy attack oraccident, presents a situation which may require rapid situationalassessment and damage control in a potentially hazardous environment.Rapid situational assessment of environments such as the compartment ofa ship, including views within the compartment and detection of heatand/or other potentially hazardous environmental conditions, isessential for coordinating a response and mitigating damage to rescuers,responders, victims, and property.

During an event including a hazardous environment, responders may needto inspect rooms, areas, or other compartments that may have beenexposed to dangerous and possibly lethal environmental conditions. Evenif the hazardous environmental conditions were known, response may beslowed due to the need for responders to don protective gear andphysically avoid hazards. In some situations, it may be impossible for ahuman to assess an area due to fire, flooding, or other environmentalconditions for which there is no protection.

Accordingly, there is a need and desire for a system and method forassessing environmental conditions and obtaining images from potentiallyhazardous environments, while preserving the health and lives of thedamage control teams.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of a system for obtaining environmental informationand images, in accordance with embodiments described herein.

FIG. 2 is a diagram of a sensor device for obtaining environmentalinformation and images, in accordance with embodiments described herein.

FIG. 3 is a schematic diagram of an electronic assembly of a sensordevice for obtaining environmental information and images, in accordancewith embodiments described herein.

FIG. 4 is a cross-section of a wall of an enclosure of a sensor devicefor obtaining environmental information and images, in accordance withembodiments described herein.

FIG. 5 shows a camera assembly used in a sensor device for obtainingenvironmental information and images, in accordance with embodimentsdescribed herein.

FIG. 6A is a diagram of a host for receiving and displayingenvironmental information and images obtained by a sensor device, foruse with embodiments of a system described herein.

FIG. 6B shows a user interface displaying environmental information andimages, for use with embodiments of a system described herein.

FIG. 7 is a flow chart of a method for obtaining environmentalinformation and images, in accordance with embodiments of a systemdescribed herein.

DETAILED DESCRIPTION OF THE INVENTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof and illustrate specificembodiments that may be practiced. In the drawings, like referencenumerals describe substantially similar components throughout theseveral views. These embodiments are described in sufficient detail toenable those skilled in the art to practice them, and it is to beunderstood that structural and logical changes may be made. Sequences ofsteps are not limited to those set forth herein and may be changed orreordered, with the exception of steps necessarily occurring in acertain order.

Disclosed embodiments provide for collection of images and environmentalinformation from potentially hazardous environments. Disclosedembodiments include a system for obtaining and displaying such imagesand environmental information from environments, as well as variousapparatuses for use in this system. Apparatuses described include adeployable sensor device and a host. Embodiments of the system and thesensor device include a sensor device having an enclosure providingprotection from hazardous environmental conditions and shock, the sensordevice having camera assemblies and environmental sensors for capturingimages and environmental information, respectively, and a communicationsinterface for transmitting these images and environmental information toa host for display and/or analysis. Further, disclosed embodimentsinclude methods for obtaining the images and environmental information.

FIG. 1 shows a system 100 for obtaining environmental information andimages, in accordance with embodiments described herein. System 100includes one or more sensor devices 200 for obtaining environmentalinformation and images, and at least one host 600 for receiving anddisplaying the environmental information and images from sensor device200.

Sensor device 200 and host 600 interact via a communications link 102.Communications link 102 is preferably a two-way wireless communicationsinterface, such as an 802.11(b) signal, or any other 802.11 wirelesscommunications interface or “Wi-Fi” communications interface, as arecommonly known in the art. In another embodiment, communicationsinterface 102 is a wired communications interface, with the connectinginterface configured to allow sensor device 200 to be deployed to adesired distance from the host 600.

FIG. 2 is a diagram of the exterior appearance of sensor device 200,configured to obtain environmental information and images, in accordancewith embodiments described herein. In system 100, sensor device 200 ispreferably configured to be deployed into an environment by hand. Sensordevice 200 therefore should be configured to a size and weight such thata person is capable of moving the device into the environment. Forexample, a person can deploy sensor device 200 by picking it up andthrowing it into the environment. However, the main goal is to promoteease of deployment. Thus, sensor device 200 can be thrown, deployed byremote device (e.g., a robot), dropped out of a vehicle, or through anyother means of moving the device into the environment. Sensor device 200is designed for use in hazardous environments. For example, sensordevice 200 is designed to operate in an environment with an ambienttemperature in excess of 500 degrees for a substantially longer periodof time than other sensor devices.

Sensor device 200 comprises an enclosure 210. In one embodiment, asshown in FIG. 2, enclosure 210 is cubic-shaped, having a top surface214, a bottom surface 217, and four side surfaces 212. In a furtherembodiment, enclosure 210 is a cubic-shaped enclosure further comprisingrounded or beveled edges 213 surrounding all six faces of sensor device200. A cubic shaped enclosure with rounded edges 213 provides for easierdeployment of sensor device 200 because the shape allows for sensordevice 200 to roll initially while also causing sensor device 200 tostay at rest once its trajectory ceases. Other embodiments of sensordevice 200 include alterative shapes for the enclosure 210, such asspherical, hexagonal, or pyramidal shapes.

In a preferred embodiment, a shock-absorbing casing 222 covers edges 213of the faces of sensor device 200, providing protection to thestructural and electrical components of sensor device 200, for instancewhen sensor device 200 is thrown by hand. Casing 222 is located on theexterior of sensor device 200 and not protected by any insulation, andthus must be capable of withstanding temperatures and/or otherenvironmental elements of hazardous environments. A material that burns,melts, or corrodes under environmental conditions in which sensor device200 is designed to operate could interfere with operation of cameraassemblies 500 and/or environmental sensors 220, potentially disablingsensor device 200 (FIG. 2). A preferred embodiment of casing 222 is madefrom silicone rubber, such as Silastic™ silicone rubber manufactured byDow Corning™. Silicone rubber is a flexible yet durable material that isalso resistant to extreme temperatures.

Enclosure 210 preferably has dimensions that permit sensor device 200 tobe deployed, for example, by hand, and thus preferably has a maximumsize that is less than twenty-four (24) inches in length on any oneexterior surface, and more preferably, approximately six (6) inches inlength on all sides. The minimum size of the enclosure 210 will bedetermined by the space required to house the electronics assembly 300and the thickness of the enclosure 210.

In the embodiment of sensor device 200 shown in FIG. 2, sensor device200 includes side surfaces 212 (two of which are visible in FIG. 2).Side surfaces 212 include environmental sensors 220 and camera portals224.

Each camera portal 224 consists of a transparent material affixed inside surface 212 providing for light to pass through the camera portal224 to a camera assembly 500 (FIG. 5) inlaid within the side surface.Camera portal 212 is a pane of translucent material, such as, forexample, quartz crystal glass, or translucent hardened plastics.Alternatively, the camera portal 224 can alternatively be a lens of thecamera assembly 500 itself. Each camera portal 224 is flush with theside surface 212 in order to provide better rolling characteristics.Each side surface 212 and camera portal 224 is sealed to prevent water,smoke, and other hazards contained in the external environment frompermeating sensor device 200.

Sensor device 200 includes a camera assembly 500 (FIG. 5) inlaid withinat least one of its exterior surfaces 212, 213, 214. In the embodimentshown in FIG. 2, each side surface 212 of sensor device 200 has a cameraassembly 500 contained within the enclosure 210, with the lens of thecamera assembly 500 either located behind and protected by therespective camera portal 224, or comprising the respective camera portalitself.

Camera assembly 500 includes a small board-level camera circuit 554 andcamera lens 552. The camera circuit 554 can either consist of a barecircuit board along with a lens mount, thus requiring minimal additionalcircuitry for each camera assembly 500, or separated sets of componentsintegrated into a single hardened mother board. Camera assembly 500 alsoincludes a camera interface 556 for transmitting obtained images to acentral processor 330 (FIG. 3).

Embodiments of camera assembly 500 employ any type of imaging system,including infra-red or other non-visual spectra. Within the visiblerange, any type of camera technology is used, including CMOS or CCDimaging. While CCD camera assemblies tend to offer better intensitydiscrimination, CMOS camera assemblies tend to offer faster readout andlower power consumption. Camera assembly 500 is configured to obtainvideo images, or, alternatively, still images. Camera assembly 500 isconfigured to obtain color or monochromatic (i.e., black and white)images at any desired resolution that is available. Camera assembly 500may be selected based upon a variety of factors, including resolution,sensitivity, size, weight, durability, camera interface, and method ofexposure control.

In a preferred embodiment, camera assembly 500 includes a monochrome CCDimager system, with a USB interface configured to operate with aWindows™ or Linux™-based processor. Such a camera is provided by Sentechmodel STC-B33USB. Camera lens 552 has a focal length preferably in therange from 1.7 mm to 3.6 mm, and most preferably 2.5 mm. However, otherfocal lengths are within the scope of this invention. Camera assembly500 provides for analog-to-digital conversion of the obtained imagesignal. Alternatively, camera assembly 500 outputs an analog imagesignal to central processor 330, and central processor 330 providesanalog-to-digital conversion.

Camera assembly 500 is shown inlaid in a side surface 212 of a sensordevice, such as sensor device shown in FIG. 2. Camera lens 552 ispositioned behind camera portal 224. Camera portal 224 provides aviewpoint for camera assembly 500, while protecting the lens andproviding a flush and sealed side surface of sensor device 200 (FIG. 2).In one embodiment, camera lens 552 is perpendicular to the respectiveside surface 212. In another embodiment, camera lens 552 is located atan angle to the respective side surface 212. For example, camera lens552 can be directed at an angle slightly above parallel to the groundlevel, providing greater coverage of the environment.

Referring back to sensor device 200 of FIG. 2, the visible side surfaces212 of sensor device 200 also include environmental sensors 220. In apreferred version of sensor device 200, environmental sensors fordetecting and measuring levels of oxygen, hydrogen sulfide, and carbonmonoxide in an environment would be used. It should be understood,however, that sensor device 200 could be configured to detect thepresence and/or levels of any environmental condition in which thereexists a commercially available environmental sensor. Variousenvironmental sensors are known in the art, and are configured to detecttemperature, smoke, or levels of various gaseous elements in theenvironment. For instance, known environmental sensors include sensorsthat detect the presence and/or levels of: hydrogen sulfide; oxygen;carbon monoxide; carbon dioxide; chlorine; hydrocarbons; smoke; heat;nuclear and other radiation; poisonous gases and/or particles (e.g.,anthrax); and fire suppression agents.

Sensor device 200 also includes a tether attachment connector 216 toenable retrieval of sensor device 200, for example by a mechanical meansthat connects to the tether attachment connector 216. The tetherattachment connector 216 is located on a top surface 214 of sensordevice 200 that is designed to face upwards when sensor device 200 is atrest. The tether attachment connector 216, for example, can be a hook, amagnetic or electro-magnetic connection device, or any other connectiondevice designed to allow attachment by a mechanical means, such as apole or hook. The tether attachment connector 216 is preferably flushwith or inlaid in a surface of the enclosure 210 to minimize the effectof the tether attachment connector 216 on the rolling trajectory ofsensor device 210.

Sensor device 200 also includes a charging terminal 218 on the exteriorof enclosure 210. The charging terminal 218 is used to charge and/orrecharge a power source 338 (FIG. 3) of sensor device 200. The chargingterminal 218 is preferably located on a top surface 214 of the enclosure210, as shown in FIG. 2. Alternatively, charging terminal 218 can belocated on a side surface 212 or bottom surface 217 of the enclosure210. The charging terminal 218 is configured to allow serial charging ofmultiple sensor devices 200 when the sensor devices 200 are stowed; forinstance, a charging terminal 218 located on a top and a bottom surface217 of a sensor device provides for charging of the respective powersources of multiple sensor devices 200 when the multiple sensor devices200 were stacked on top of one another.

A bottom surface 217 of the enclosure 210 of sensor device 200—that is,a surface intended to rest on the floor when sensor device 200 comes torest—includes extra weighting, such as a layer or object not included inother surfaces of the enclosure 210. The extra weighting of the bottomsurface 217 provides for improved deployment of sensor device 200—whensensor device 200 is thrown or otherwise deployed, it is more likelythat none of the side surfaces 212 having camera portals 224 andenvironmental sensors 220 will be facing the ground and thusincapacitated.

FIG. 3 is a schematic diagram of an electronics assembly 300 of a sensordevice 200. Electronics assembly 300 includes the electronic elements ofsensor device 300 electronically coupled to a central processor 330. Theelectronic elements shown in electronics assembly 300 include one ormore camera assemblies 500, a power source 338 with an optional chargingterminal 218, environmental sensors 220 coupled to an environmentalsensor amplifier 334, a board temperature sensor 340, a microcontroller336 that receives signals from the environmental sensor amplifier 334and/or the board temperature sensor 340, and a device externalcommunications interface 332. The elements are described further below.

Central processor 330 is configured to provide central control, dataacquisition, and communications support for sensor device 200. Centralprocessor 330 receives environmental information from the variousenvironmental sensors 220, images from camera assemblies 500, andsupports wireless communications via a device external communicationinterface 332. The environmental information and images received by thecentral processor 330 may be either analog or digital, and thus centralprocessor 330 is configured to receive either analog or digital signals,and to provide analog-to-digital conversion of received analog signals.Alternatively, a separate analog-to-digital converter is included inelectronics assembly 300 (such as in microcontroller 336). Centralprocessor 330 is also preferably configured to provide compression(i.e., JPEG or MPEG-2 compression) of high-bandwidth digital data, suchas still or video images, prior to the transmission of the digital datato host 600 (FIG. 1) via the device external communication interface332.

Central processor 330 includes a software package configured to acquireand compress images and environmental sensor information, and transmitthe images and environmental information over an IP network interfacevia the external communication interface 332. Any known wirelesssoftware package is used. For example, an open-sourced software platformsuch as Linux™ or any versions of the Windows™ operating system areadaptable to the instant invention. Open-sourced software generally maybe freely copied, modified, and used, and thus is conducive to beingadapted for use in central processor 330 of sensor device 200.

A preferable software package for central processor 330 includes acamera driver providing operation (i.e., exposure and readout) andcontrol (i.e., exposure conditions such as shutter speed, gain, andclocking rate) of camera assembly 500. Preferably, the software packageand camera driver are configured to allow for obtaining and transmittingeither still or video images. A preferable software package alsoincludes a module providing for compression of digital signals receivedby central processor 300. A preferable software package also includes amodule for receiving and converting analog signals from environmentalsensors 220 and/or board temperature sensor 340, or, alternatively,receiving digitized versions of the environmental information and boardtemperature information from microcontroller 336 (as further discussedbelow).

The software package of central processor 330 also preferably includes amodule for outputting environmental, image, and/or other data to anexternal communications interface, i.e., device external communicationsinterface 332. For example, image and environmental data can be outputin discrete portions also known as “messages.” Each image messagecontains, for example, one frame of compressed or uncompressed imagedata from a camera assembly 500. Each environmental message contains,for example, sensor information from all environmental sensors 220 insensor device 200. Each message is time-stamped for subsequent analysispurposes, and converted into standard TCP/IP or UDP/IP protocols, as iscommonly known in the art, for transmission to the host via externalcommunication interface 332.

Electronics assembly 300 also includes one or more environmental sensors220. As described above, environmental sensors 220 are configured todetect the presence of and/or levels of various gaseous and otherenvironmental conditions, including, but not limited to: hydrogensulfide; oxygen; carbon monoxide; carbon dioxide; chlorine;hydrocarbons; smoke; heat; nuclear and other radiation; poisonous gasesand/or particles (e.g., anthrax); and fire suppression agents.

Environmental sensors 220 are commonly configured to generate an analogsignal indicating the presence of and/or a level of an environmentalcondition. This analog signal generated by environmental sensors 220typically ranges from less than 0.1 microamps to approximately 100microamps, depending upon the configuration of the particularenvironmental sensor 220 and the type and amount of the detectedenvironmental condition in the atmosphere. Electronics assembly 300 alsoincludes an environmental sensor amplifier 334 configured to amplify theanalog signals generated by environmental sensors 220. Amplification isoften necessary to render the generated analog signals conducive toanalog-to-digital conversion. For instance, typical circuits providinganalog-to-digital conversion require received analog signals in therange of zero (0) to five (5) volts. Thus, environmental sensoramplifier 334 is configured to provide varying levels of amplificationfor various environmental sensors, depending upon the amplitude range ofthe analog signal generated by the respective environmental sensor 220.

The electronic elements in electronics assembly 300 are sensitive tolevels of heat and cold. For instance, temperatures in excess of 185degrees Fahrenheit can render electronic elements inoperative. Inaddition to ambient heat frequently present in hazardous environments,electronics assembly 300 receives heat generated by the normal operationof electronic elements such as power source 338 and central processor330. Electronics assembly 300 also includes a board temperature sensor340 that is configured to monitor the temperature of a portion of theelectronics assembly 300, and provide internal temperature informationto host 600 (FIG. 1). Board temperature sensor 340 is configured togenerate an analog or digital signal indicating the internal temperatureof the electronics assembly 300.

Analog signals generated by environmental sensors 220 and/or boardtemperature sensor 340 are preferably converted to digital signals priorto processing by central processor 330 and transmission via deviceexternal communications interface 332. In one embodiment, centralprocessor 330 is configured to provide analog-to-digital conversion ofanalog signals. In another embodiment, analog-to-digital conversion ofanalog signals is provided by a microcontroller 338 before the signalsare provided to central processor 330. Microcontroller 338 includesanalog-to-digital converters configured to sample analog signals fromenvironmental sensors 220 and/or board temperature sensor 340. In thisembodiment, microcontroller 338 provides the digitized signals tocentral processor 330 through a serial interface, such as a RS-232interface.

Microcontroller 338, for example, includes its own software packageconfigured to provide for acquisition of analog signals fromenvironmental sensors 220 and/or board temperature sensor 340,analog-to-digital conversion of the received analog signals, andtransmission of these signals to central controller 330. Such a softwarepackage can be written in standard C or C++ programming platform.Alternatively, the software package is adapted for use in sensor device200 using an open-sourced platform, such as a version of Linux™ formicrocontrollers.

Electronics assembly 300 also includes a power source 338 for poweringelectronic elements including central processor 330 and/ormicrocontroller 336. Power source 338 also directly powers otherelements of electronics assembly 300, such as camera assemblies 500,environmental sensors 220, environmental sensors amplifier 334, boardtemperature sensor 340, and/or device external communications interface332. Alternatively, power source 338 powers some or all of theseelements of electronics assembly 300 through their respective interfaceswith central processor 330 and/or microcontroller 336. For instance,camera assemblies 500 are interfaced to central processor 330 via aserial USB interface that provides a power signal to camera assemblies500 as well as providing for the transmission of data.

Power source 338 preferably comprises one or more NiMH batteries. NiMHbatteries typically have a nominal voltage of 1.2 volts. Depending uponthe voltage necessary to power elements of electronics assembly 300,power source 338 may comprise a plurality of NiMH batteries in series.For example, in a preferred embodiment, central processor 330 andmicrocontroller 336 tolerates a voltage range from approximately 4.7 to5.3 volts. Thus, four NiMH batteries, each providing a 1.2 volt charge,are linked in series to provide a 4.8 volt charge to central processor330 and microcontroller 336. In other embodiments, power source 338 maycomprise other battery technologies, such as one or more LiON batteries,for example.

Electronics assembly 300 also includes a device external communicationsinterface 332 for transmitting image, environmental, and otherinformation to host 600 via communications link 102 (FIG. 1). Externalcommunications interface 332 is preferably configured to transmitdigital data via a wireless signal, such as a “Wi-Fi” 802.11 signal,over a range of 100 feet or more. External communications interface 332is preferably configured to transmit data formatted in standard TCP/IPor UDP/IP protocols. External communications interface 332 preferablyprovides a two-way communications interface, so that sensor device 200also receives control and other information from host 600 viacommunications link 102. Embodiments of external communicationsinterface 332 comprise, for example, a compact flash wireless card withan internal or external antenna. For example, an embodiment of externalcommunications interface 332 comprising a compact flash wireless card byEmbeddedWorks and an antenna (located either external or internal) thatprovides wireless 802.11 transmission of TCP/IP or UDP/IP data over 400feet.

FIG. 4 is a cross-sectional diagram of a single wall of enclosure 210 ofsensor device 200. The wall of enclosure 210 includes an innerstructural layer 414 providing the structural integrity of the enclosure210, an insulating layer 412 for mitigating the effects of environmentalheat on electronics assembly 300, and an outer layer 418 for coveringand protecting electronics assembly 300 and other components of sensordevice 200.

Structural layer 414 is formed from known and readily available formablematerials such as, for example, fiberglass, ceramics, engineeringplastics, polycarbonate, acrylonitrile butadiene styrene (ABS), orpoly-tetrafluoroethene (PTFE or Teflon™). A preferred embodiment ofstructural layer 414 is formed from fiberglass, because fiberglass ismechanically suited to being deployed into a hazardous environment. Forinstance, a structural fiberglass layer can be custom formed from knownmethods, and may be lightweight, resistant to shattering even whendamaged, and have low thermal conductivity yet high tolerance to extremeheat and cold.

Insulating layer 412 is designed to be safe for use in temperatures inexcess of 500 degrees Fahrenheit. Insulating layer 412 also providesshock absorption protection for the inner structural layer 414 andelectronics assembly 300. Insulating layer 412 is formed from known andreadily available formable insulating materials such as, for example,silica aerogels, ceramics, thermoplastic polyimides, Nanopore™ thermalinsulation, or fiberglass.

A preferred embodiment of insulating layer 412 is formed from a silicaaerogel derivative, such as Pyrogel™ manufactured by Aspen Aerogels,Pyrogel™, for example, has a thermal conductivity in the range of 0.0015W/m-K and 0.0030 W/m-K, depending upon temperature, and has a maximumuse temperature of 725 degrees Fahrenheit. Pyrogel™ also provides someshock absorption, and has a flexible base making it less prone tocracking or shattering.

Outer layer 418 provides covering protection to the other layers ofenclosure 210 and the components of sensor device 200. Outer layer 418also includes openings for one or more camera portals 224 or sensors 220(FIG. 2). Outer layer 418 is not protected by any insulation, and thusmust be capable of withstanding temperatures and/or other environmentalelements of hazardous environments. A material that burns, melts, orcorrodes could interfere with operation of camera assemblies 500 and/orenvironmental sensors 220, potentially disabling sensor device 200 (FIG.2). Outer layer 418 also provides some insulation to the other layersand electronics assembly 300.

Outer layer 418 is formed from known and readily available formablematerials such as, for example, polyimide film, aluminum foams,fiberglass, or rubbers. In a preferred embodiment, Kapton™ polyimidefilm is used to form outer layer 418, because of its high tolerance toheat, thin layering, and light weight.

Sensor device 200 also includes a phase change material (PCM) layer 416to further protect electronics assembly 300 from heat. Phase changematerials are materials designed to exploit the fact that a changebetween phases of matter (solid, liquid, gas) either absorbs or releasesenergy. PCM's for electronics are designed to change from solid toliquid. By including PCM within enclosure 210, the phase change absorbsenergy that would otherwise cause an increase in temperature. The phasechange, then, prolongs the amount of time electronics can survive whenthey are being heated. However, while PCM helps protect againstenvironmental heat, it also acts as an insulator and does not allow thedissipation of heat generated internally by electronics assembly 300.Thus, the use of PCM may reduce run time of sensor device 200 in aroom-temperature environment. Therefore, another embodiment of system100 (FIG. 1) includes multiple sensor devices 200, with some sensordevices 200 that include phase change material 416 for use inhigh-temperature environments, and other sensor devices 200 that do notinclude phase change material 416 for non-high-temperature environments(i.e., environments with an ambient temperature less than the maximumoperational temperature for electronic elements of sensor device 200).

In one embodiment of a sensor device including PCM, shown in FIG. 4,phase change material 416 is an additional layer of enclosure 210.Alternatively, the interior of enclosure 210 is filled with loose phasechange material 416. Loose phase change material 416 is available inmicroencapsulated or non-microencapsulated form. Microencapsulated PCMcomprises numerous microcapsules each having a core that changes phasewhile suspended within a shell that stays solid. Thus, microencapsulatedPCM remains granular, even after multiple use cycles, and will not melttogether into a large block, unlike non-microencapsulated PCM. Inaddition to selecting between microencapsulated or non-microencapsulatedPCM, considerations in selecting a suitable PCM for phase changematerial 416 include the energy required for phase change (usuallyexpressed in terms of kilojoules per kilogram or kJ/kg), and the phasechange temperature indicating the temperature at which the PCM changesphase. Microencapsulated PCM material typically provides lower energyabsorption than non-microencapsulated PCM.

Preferably, an embodiment of sensor device 200 for use inhigh-temperature environments includes phase change material 416requiring a high energy for phase change (usually expressed in tennis ofkilojoules per kilogram or kJ/kg) and having a phase change temperatureslightly lower than the upper temperature limit of electronic elementsin electronics assembly 300 (for instance, slightly lower than 185degrees Fahrenheit for preferred electronic elements). For example,Microtek™ MPCM-52D™ PCM is a microencapsulated PCM with a phase-changeenergy of approximately 139 kJ/kg and a melting point of approximately125 degrees Fahrenheit. Other exemplary PCM materials include HoneywellAstor™ Astorphase 54™ PCM, a non-microencapsulated PCM with aphase-change energy of 220 kJ/kg and a melting point of approximately129 degrees Fahrenheit, and Rubitherm™ RT 54™ PCM, anon-microencapsulated PCM with a phase-change energy of 181 kJ/kg and amelting point of approximately 134 degrees Fahrenheit.

Referring back to FIG. 1, images and environmental information fromsensor device 200 is transferred via communications link 202 (forexample, a wireless 802.11 “Wi-Fi” communications link) to host 600.FIG. 6A is a diagram of a preferred embodiment of a host for receivingand displaying environmental information and images obtained by aportable sensor device, for use with embodiments of sensor system 100.

In the preferred embodiment, host 600 is a computer system. The computersystem can be any known computer system, including, for example, apersonal computer such as a laptop computer, a minicomputer, a mainframecomputer, a personal digital assistant (PDA), or multiple computers in asystem. For example, host 600 comprises a laptop computer with an Intel™Core Duo™ Processor using x86 architecture. The computer system willtypically include at least one display 670, input device 664, and hostexternal communications interface 662, but may include more or fewer ofthese components. Typically, internal components of host 600 will alsoinclude at least one processor, as well as random access memory (RAM).The processor can be directly connected to display 670, or remotely overcommunication lines such as telephone lines, local area networks, or anyother network for data transmission. Host 600 preferably is configuredto run on a Linux™ operating system (an open source software platform).

Display 670 of host 600 displays a user interface 672 for presenting allcollected images and environmental information collected and transmittedby sensor device 200. In the preferred embodiment, user interface 672 isgenerated by a Java-based software package, such as a variation of thePanelBuilder™ software package developed by Adaptive Methods™. However,any known or suitable user interface for interaction with cameras and/orsensors can be used.

FIG. 6B shows an embodiment of user interface 672. In a preferredembodiment of user interface 672 includes an advisory display panel 674,a control display panel 676, an environmental sensor display panel 678,and an image display panel 680.

Advisory display panel 674 displays hardware, software, and/or dataadvisories related to the operation of sensor device 200 and/orcommunications link 102 (FIG. 1). These advisories include various colorcodes and other images associated with various alert levels, categories,and alarms to be presented to the operator. A separate panel provides anoperator interface for review of past advisories. Alarms are availablefor each environmental sensor 220 or environmental condition. If acertain environmental condition is detected (for example a thresholdtemperature), an alarm is displayed in advisory display panel 674. Allsuch thresholds are XML configurable items and linked to a particularenvironmental condition detected. An operator of sensor system 100(FIG. 1) are provided with capability to set thresholds on environmentalsensor display panel 678 (discussed below).

Control display panel 676 displays and provides a user interaction withcontrols for managing information and images displayed on user interface672. For example, control panel includes a timeline scroll bar foradjusting between the display of current and stored past images andenvironmental information in user interface 672. Control display panel676 also displays and provides interaction with controls for controllingsensor device 200 (FIG. 2)

Environmental sensor display panel 678 provides a flexible layout forpresenting all collected environmental information from environmentalsensors 220. Environmental sensor display panel 678 is dynamicallyreconfigurable to a single or multi-column format to show all thesensors reporting from the deployed unit. Environmental information isdynamically and automatically added to environmental sensor displaypanel 678 as it is received. In the event that more environmentalinformation is received than can be reasonably displayed inenvironmental sensor display panel 678, a vertical scroll bar isprovided to scroll amongst environmental information.

Environmental sensor display panel 678 displays separate sub-panels forthe environmental information captured by each environmental sensor 220of sensor device 200 (FIG. 2), or, alternatively, displays separatesub-panels for each environmental condition detected or testedseparately. A separate XY chart and/or sensor icon is displayed for eachenvironmental sensor 220 and/or environmental condition displayed. TheXY chart displays a time history on the X axis and a level on the Yaxis.

Environmental sensor display panel 678 is also configured to adjustcharacteristics of displayed information according to various thresholds(for example, in accordance with alert levels triggering alerts inadvisory display panel 674). The sensor icon and/or XY chart may vary incharacteristics such as color, size, or format according to detectedenvironmental conditions. The characteristics are stored so that anoperator of sensor system 100 (FIG. 1) can review previous environmentalinformation to see which sensors have exceeded thresholds at anytime inthe past.

User interface 672 also includes an image display panel 680 configuredto display images obtained by camera assemblies 500 of sensor device200. Images are dynamically and automatically added to image displaypanel 680 as they are received. In the event that more images arereceived than can be reasonably displayed in image display panel 680, ahorizontal scroll bar is provided to scroll amongst present and pastimages. Each individual image panel preferably has control buttonsconfigured to, for example, rotate the individual image clockwise,provide a cursor crosshair, zoom to a cursor crosshair, and/or maximizethe individual image to take up the entire display area of userinterface 672. Preferably, image display panel 680 is configured todisplay four images in horizontal panels, each image being the mostrecent from each of respective four camera assemblies 500 in thepreviously described preferred embodiment of sensor device 200 (FIG. 2).

FIG. 7 is a flow chart of a method 700 for obtaining environmentalinformation and images using sensor system 100 described above. In step702, at least one sensor device 200 is activated and deployed. Sensordevice 200 is activated, for example, by a control signal transmittedfrom host 600 to sensor device 200, by removing a charge from chargingterminal 218 (FIG. 2), by activating a switch on sensor device 200, orby any other means of activating an electronic device. Alternatively,sensor device 200 is configured to remain activated during itsfunctional lifetime, or during all times when it may be deployed. Instep 702, sensor device 200 is deployed by any known means for deployinga small object. Preferably, sensor device 200 is deployed manually(i.e., by hand) by a person. It should be understood that sensor device200 may be activated either before or after deployment.

In steps 704-720, sensor system 100 obtains, transmits, and displaysimages and/or environmental information. It should be understood,however, that steps 704-720 may be conducted continuously, and in anysequence, except when steps necessarily occur in a certain order.Commonly, several steps will be conducted simultaneously. For example,sensor device may obtain images substantially simultaneously whileobtaining environmental information, the images and environmentalinformation may be digitized, processed, and/or transferredsimultaneously or at different times, and the transmitted images andenvironmental information may be generated for display on user interface672 simultaneously or at the different times.

Steps 704-708 relate to obtaining images. In step 704, one or morecamera assemblies 500 of sensor device 200 capture images from theenvironment and convert the images to image signals. In step 706, theanalog image signals are converted to digital data throughanalog-to-digital conversion that is provided by camera assembly 500, orby central processor 330 (FIG. 3). In step 708, the digital image datais compressed to a known compression format (e.g., JPEG or MPEG-2), forinstance by central processor 330.

Steps 710-714 relate to obtaining environmental information and internaltemperature information. In step 710, environmental sensors 220 (FIG. 3)detect the presence of and/or levels of environmental conditions such astemperature and/or hazardous elements in the air. Environmental sensors220 generate an analog signal according to the presence of and/or levelof the particular environmental condition each environmental sensor isconfigured to detect. In step 712, board temperature sensor 340optionally detects an internal temperature of sensor device 200 andgenerates an analog signal according to the detected temperature. Instep 714, the analog signals from environmental sensors 220 and/or boardtemperature sensor 340 are converted to digital data throughanalog-to-digital conversion that are provided by microcontroller 336 orby central processor 330 (FIG. 1),

In step 716, sensor device 200 transmits the environmental and imagedata via communications link 102 (FIG. 1) to host 600. Communicationslink 102 is a two-way communications link provided by device externalcommunication interface 332 (FIG. 3) and host external communicationsinterface 662 (FIG. 6A). Communications link 102 is preferably awireless communications interface, such as an 802.11(b) signal, or anyother 802.11 wireless communications interface or “Wi-Fi” communicationsinterface, as are commonly known in the art. The transmitted data ispreferably formatted by central processor 330 to be divided into aseries of “messages,” each message containing data representing one ormore obtained images and/or environmental sensor information. Eachmessage is time stamped for subsequent analysis purposes, and convertedinto standard TCP/IP or UDP/IP protocols by central processor 330, as iscommonly known in the art. The message is then transmitted to host 600via device external communication interface 332.

In step 718, host 600 receives the transmitted environmental and imagedata via host external communications interface 662 (FIG. 6A). Thereceived environmental and image data is preferably stored inrandom-access memory (RAM) by host 600 for immediate presentationpurposes. Alternatively, or in addition to being stored in RAM, thereceived environmental and image data is stored on a hard drive forfuture analysis and/or presentation. Also in step 718, host 600decompresses any image or environmental data that was compressed priorto transmission.

In step 720, host 600 generates a user interface 672 on display 670,presenting the received images and/or environmental information fromsensor device 200. As discussed above, the most recently received imagesand environmental information are presented in user interface 672 alongwith previously received images and environmental information.Preferably, host 600 is configured to present received images andenvironmental information on user interface 672 automatically anddynamically, as described above.

Embodiments described herein include methods, systems, and apparatusesfor obtaining images and environmental information from potentiallyhazardous environments. The described embodiments provide a system andmethod for collecting environmental information and images frompotentially hazardous environments, while preserving the health andlives of the damage control teams. For example, the embodiments providefor rapid situational assessment of environments such as the compartmentof a ship, including views within the compartment and detection of heatand/or other potentially hazardous environmental conditions, thusfacilitating coordination of a response and mitigating damage torescuers, responders, victims, and property.

It should be understood that while preferred embodiments are described,embodiments of the invention are not limited to those described above,but also may include other variants and/or additions. For instance,steps in described methods may occur in varying orders, and severalsteps may occur in parallel. Components of described apparatuses mayinclude obvious variants and other components that achieve the samefunctional purpose. Accordingly, the invention should be limited only bythe claims below.

1. A portable sensor device for collecting information from anenvironment, the device comprising: an enclosure having a plurality ofsubstantially flat side surfaces, a top surface, and a bottom surface;at least one camera for obtaining images inlaid in at least one of theside surfaces or the top surface; a communications interface fortransmitting obtained images from the sensor device to a remote device.2. The portable device of claim 1, wherein the communications interfaceis a wireless communications interface for transmitting a wirelesssignal to the remote device.
 3. (canceled)
 4. The portable device ofclaim 1, further comprising a casing covering edges of the enclosure. 5.The portable device of claim 1, wherein the enclosure is a cubicenclosure having four side surfaces.
 6. The portable device of claim 1,wherein the enclosure further comprises rounded edges or beveled edgessurrounding at least one of the surfaces.
 7. The portable device ofclaim 5, further comprising: camera assemblies inlaid in each of thefour side surfaces; and environmental sensors inlaid in each of the fourside surfaces.
 8. (canceled)
 9. The portable device of claim 1, furthercomprising a charging terminal located on at least one of the top, side,and bottom surfaces.
 10. The portable device of claim 1, the bottomsurface further comprising a weighted material for making the bottomsurface heavier than the side and top surfaces. 11-15. (canceled) 16.The portable device of claim 1, further comprising at least oneenvironmental sensor for obtaining the environmental information inlaidin at least one of the surfaces.
 17. The portable device of claim 16,wherein the at least one environmental sensor is configured to obtaininformation on at least one of: a temperature of the environment; levelsof carbon dioxide in the environment; levels of chlorine gas in theenvironment; levels of hydrocarbons in the environment; levels of smokein the environment; levels of fire suppression agents in theenvironment; levels of radiation in the environment; levels of hydrogensulfide in the environment; levels of oxygen in the environment; andlevels of carbon monoxide in the environment. 18-24. (canceled)
 25. Theportable device of claim 1, further comprising a phase change materialconfigured to absorb energy from heat within the enclosure. 26-28.(canceled)
 29. A system for collecting information, the systemcomprising: a host device a portable device configured to obtaininformation from the environment, the portable device comprising: anenclosure having a plurality of substantially flat side surfaces, a topsurface, and a bottom surface; at least one camera for obtaining imagesinlaid in at least one of the side surfaces or the top surface; and acommunications link for transmitting information between the portabledevice and the host.
 30. The system of claim 29, wherein thecommunications link is a wireless communications link.
 31. (canceled)32. The system of claim 29, the portable device further comprising atleast one environmental sensor inlaid in one of the side surfaces or thetop surface. 33-34. (canceled)
 35. The system of claim 29, wherein thehost comprises a user interface configured to display: images obtainedby the portable device; and controls for user interaction with theportable device.
 36. A method of collecting images and environmentalinformation, the method comprising: deploying a portable device into ahazardous environment by throwing the portable device into the hazardousenvironment; obtaining images of the hazardous environment with theportable device; and transmitting images from the portable device to ahost using a communications link.
 37. (canceled)
 38. The method of claim36, further comprising: obtaining environmental information with theportable device; and transmitting environmental information from theportable device to the host using the communications link.
 39. Themethod of claim 36, further comprising: monitoring an internaltemperature of the portable device.
 40. (canceled)
 41. The method ofclaim 36, wherein the environmental information obtained includes atleast one of: a temperature of the hazardous environment a level ofcarbon monoxide in the environment; a level of oxygen in theenvironment; a level of hydrogen sulfide in the environment a level ofcarbon dioxide in the environment; a level of chlorine gas in theenvironment; a level of hydrocarbons in the environment; a level ofsmoke in the environment; a level of fire suppression agents in theenvironment; and a level of radiation in the environment. 42-45.(canceled)
 46. The portable device of claim 1, further comprising aninternal temperature sensor configured to monitor an internaltemperature of the portable device.